Thermoelectric module
US7299639B2 · kind B2 · utility
42Cited by
12References
27Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 22, 2004 |
| Grant date | Nov 27, 2007 |
| Priority date | — |
| Expiry date | Nov 4, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A thermoelectric module having areas of highly thermally conductive material integrated into a substrate layer. For one embodiment copper pads are integrated into the external surface of the substrate of the hot side of the thermoelectric module. The copper pads allow direct connection of a heat removal device to the thermoelectric module thereby reducing thermal resistance. Thermal vias may be formed through the substrate to further reduce thermal resistance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.