Low-density part injection molding system
US7300268B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 15, 2005 |
| Grant date | Nov 27, 2007 |
| Priority date | — |
| Expiry date | Dec 15, 2025 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C44/0415
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
An injection molding system (10) includes a first mold half (20) and a second mold half (22), which forms a cavity (23) with the first mold half (20). A cavity intrusion element (34) is displaceable to extend within the cavity (23). A displacement mechanism (36) is coupled to the cavity intrusion element (34). A controller (38) is coupled to the displacement mechanism (36) and controls the intrusion depth (D) of the cavity intrusion element (34) during an injection molding process. A method of forming an article includes the pressurizing of the cavity (23) within a mold (14) via a gas. A material having a blowing agent is injected into the cavity (23). The gas pressure within the cavity (23) is released. The cavity intrusion element (34) is backed out from within the cavity (23). The material is cured.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.