CMP diamond conditioning disk
US7300338B2 · kind B2 · utility
8Cited by
5References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 23, 2006 |
| Grant date | Nov 27, 2007 |
| Priority date | — |
| Expiry date | Aug 23, 2026 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D18/00
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of making and the resulting non-metallic CMP conditioning pad comprising a non-metallic substrate and a single layer of abrasive particles bonded to the substrate by a non-metallic bonding medium. Preferred substrates include aluminum oxide and graphite. A bonding system employing finely powdered aluminum oxide particles mixed with a suitable adhesive is employed to bond the abrasive layer to the aluminum oxide substrate. Silicon carbide particles mixed into a compatible adhesive carrier including a polymer composition is preferred for bonding the abrasive particle layer to a graphite or carbide substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.