Patent · US Expired

Reactive hot melt adhesive

US7300996B2 · kind B2 · utility

2Cited by

12References

17Claims

0Family size

Assignee

Henkel Kommanditgesellschaft auf Aktien · DE

Inventors

Horst Hoffmann · Pentling, DE
Uwe Franken · Dormagen, DE
Michael Krebs · Hilden, DE

Key dates

Filing date	Apr 2, 2004
Grant date	Nov 27, 2007
Priority date	—
Expiry date	Apr 2, 2024

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T428/31591
WIPO fieldMacromolecular chemistry, polymers
WIPO sectorChemistry

Abstract

One-component moisture-curing hot melt adhesive compositions based on reaction products from di- or polyisocyanates and polyether-polyols, crystalline or partly crystalline polyester-polyols and low molecular weight polymers from olefinically unsaturated monomers and optionally hydroxylated tackifying resins are suitable for high-strength and ageing-resistant gluing of profiles of plastics to one- or multilayer acrylate films.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.