Printed wiring boards possessing regions with different coefficients of thermal expansion
US7301105B2 · kind B2 · utility
54Cited by
34References
20Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 29, 2005 |
| Grant date | Nov 27, 2007 |
| Priority date | — |
| Expiry date | Dec 9, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/063
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Printed wiring boards are disclosed that include regions having different coefficients of thermal expansion. In one aspect of the invention, the regions can be matched to the coefficients of thermal expansion of devices mounted on the printed wiring board. In one embodiment, the invention includes a layer including a base material and at least one insert material that are combined using a resin. In addition, the base material and insert material are located within the same plane.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.