Head assembly having microactuator
US7301731B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 28, 2003 |
| Grant date | Nov 27, 2007 |
| Priority date | — |
| Expiry date | Dec 22, 2024 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11B5/4853
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
When wire-bonding process is effected, a head assembly is held between a pair of clamp members. A head slider is urged against a microactuator. The urging force is transmitted to the microactuator through second adhesive layers. Since the second adhesive layers are positioned symmetrically around the rotational axis of the head slider, the urging force tends to act along the rotational axis. The microactuator is simultaneously urged against the support member. The urging force is transmitted from a first adhesive layer to the support member. Since the first adhesive layer extends around the rotational axis, the urging force tends to act along the rotational axis. The head slider is thus allowed to keep a uniform attitude. The microactuator is also allowed to keep a uniform attitude. The microactuator is prevented from suffering from substantial bending stresses.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.