Architecture for power modules such as power inverters
US7301755B2 · kind B2 · utility
38Cited by
25References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 13, 2004 |
| Grant date | Nov 27, 2007 |
| Priority date | — |
| Expiry date | Jul 19, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH02M7/003
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Power converters such as power modules configured as inverters employ modularized approaches. In some aspects, semiconductor devices are thermally coupled directly to thermally conductive substrates without intervening dielectric or insulative structures. Additionally, or alternatively, semiconductor devices are thermally coupled to thermally conductive substrates with relatively large surface areas before heat transferred from the semiconductor devices encounters a dielectric or electrically insulating structure with correspondingly high thermal impedance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.