Heat-receiving apparatus and electronic equipment
US7301771B2 · kind B2 · utility
36Cited by
48References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 17, 2005 |
| Grant date | Nov 27, 2007 |
| Priority date | — |
| Expiry date | Dec 23, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A heat-receiving plate of a pump has a heat-receiving surface and a guide. The heat-receiving surface is thermally connected to a heat-generating body. The guide is provided on the heat-receiving surface. The guide is opposed to the heat-generating body.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.