Three dimensional packaging and cooling of mixed signal, mixed power density electronic modules
US7301772B2 · kind B2 · utility
14Cited by
34References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 9, 2006 |
| Grant date | Nov 27, 2007 |
| Priority date | — |
| Expiry date | Feb 9, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An integrated three dimensional packaging and cooling system for cooling an electronic component system with dissimilar power densities and interfering signals.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.