Laser micromachining methods and systems
US7302309B2 · kind B2 · utility
6Cited by
10References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 26, 2004 |
| Grant date | Nov 27, 2007 |
| Priority date | — |
| Expiry date | May 13, 2024 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2/1634
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A method of laser machining a fluid path is provided. The method comprises directing a first laser toward a first surface, directing a second laser toward a second surface of the substrate, and directing a third laser toward the second surface along at least a portion of an edge of an area that defines a portion of the fluid path on the second surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.