Heat spreaders with vias
US7303005B2 · kind B2 · utility
52Cited by
37References
33Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 25, 2006 |
| Grant date | Dec 4, 2007 |
| Priority date | — |
| Expiry date | Jun 25, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10416
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Constructions for and methods of manufacturing graphite heat spreaders having thermal vias placed therethrough are provided. Thermal vias having one or two flanges are disclosed, as are flush thermal vias. Graphite heat spreaders having surface layers covering the graphite material are provided. Graphite heat spreaders having a layer of cladding for increased structural integrity are provided. Also disclosed are methods of co-forging a graphite heat spreader element with a metal thermal via in place therein.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.