Lightweight bondhead assembly
US7303111B2 · kind B2 · utility
4Cited by
5References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 14, 2005 |
| Grant date | Dec 4, 2007 |
| Priority date | — |
| Expiry date | Oct 14, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6838
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A bondhead assembly having a bond body for mounting a bonding tool, a support structure that is configured to be drivable for moving the bondhead assembly to different locations and flexural elements arranged substantially along at least one plane which couple the bond body to the support structure for flexibly supporting the bond body during movement with respect to the support structure. A motor is coupled to the support structure and it is operative to drive the bond body to move relative to the support structure along an axis extending substantially perpendicular to the at least one plane.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.