Method and structure for controlled impedance wire bonds using co-dispensing of dielectric spacers
US7303113B2 · kind B2 · utility
15Cited by
11References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 28, 2003 |
| Grant date | Dec 4, 2007 |
| Priority date | — |
| Expiry date | Aug 10, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/049
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method (and structure) of making an electronic interconnection, includes, for a signal line to be interconnected, using a plurality of bonding wires configured to provide a controlled impedance effect.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.