Operationally interactive enclosure
US7303140B2 · kind B2 · utility
3Cited by
8References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 3, 2004 |
| Grant date | Dec 4, 2007 |
| Priority date | — |
| Expiry date | Jan 5, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20209
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A platform for electronic components has a temperature sensing array, a vibration sensing array, a programmable logic device, and one or more cooling fans. The programmable logic device receives temperature data from the temperature sensing array and structure-borne noise data from the vibration sensing array. The programmable logic device analyzes the data, and based on this analysis, maintains the temperature and low level noise requirements of the system by activating, deactivating, speeding up, or slowing down one or more cooling fans.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.