System for controlling mold temperatures
US7303387B2 · kind B2 · utility
19Cited by
186References
54Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 10, 2005 |
| Grant date | Dec 4, 2007 |
| Priority date | — |
| Expiry date | Apr 23, 2026 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29K2105/253
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Disclosed is a preferred mold design for producing plastic, molded preforms, which may be blow-molded into a container of a final, desired shape. A preferred mold includes a temperature control system for maintaining the preform mold at a desired temperature. The temperature control system can pass fluid through channels within the preform mold to cool plastic that is injected into the preform mold. In some arrangements, a mold comprises a neck finish mold, the neck finish mold comprising high heat transfer material positioned to transfer heat away from melt within a mold cavity of the mold.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.