Source bridge for cooling and/or external connection
US7303947B1 · kind B1 · utility
6Cited by
2References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 13, 2005 |
| Grant date | Dec 4, 2007 |
| Priority date | — |
| Expiry date | Feb 20, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30105
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A FET includes elongated, mutually parallel source regions separated by gate and drain regions. Conductive bridges extend over the gate and drain regions and not in electrical contact therewith to electrically and thermally interconnect the sources. A layer of dielectric is applied over surfaces, and an aperture is defined over the bridges. A thick layer of metal is applied over and in thermal and electrical contact with the bridges. Electrical and thermal connections can be made to the thick metal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.