Systems and methods utilizing an aperture with a reactive atom plasma torch
US7304263B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 5, 2004 |
| Grant date | Dec 4, 2007 |
| Priority date | — |
| Expiry date | Aug 5, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05H1/30
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
The footprint of a reactive atom plasma processing tool can be modified using an aperture device. A flow of reactive gas can be injected into the center of an annular plasma. An aperture can be positioned relative to the plasma such that the effective footprint of the plasma can be changed without adjusting the gas flows or swapping out the tool. Once the aperture and tool are in position relative to a workpiece, reactive atom plasma processing can be used to modify the surface of the workpiece, such as to etch, smooth, polish, clean, and/or deposit material onto the workpiece. If necessary, a coolant can be circulated about the aperture. Multiple apertures can also be used to provide a variety of footprint sizes and/or shapes. This description is not intended to be a complete description of, or limit the scope of, the invention. Other features, aspects, and objects of the invention can be obtained from a review of the specification, the figures, and the claims.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.