System and method for coupling internal circuitry of an integrated circuit to the integrated circuit's package pins
US7304393B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Mar 24, 2004 |
| Grant date | Dec 4, 2007 |
| Priority date | — |
| Expiry date | Nov 7, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A technique is provided for communicatively coupling internal circuitry (e.g., a resonant tank) of an integrated circuit (“IC”) with pins of the IC's package in a manner that minimizes the inductance of such coupling. In certain embodiments, more than two bondwires are coupled to an electrically common interface, wherein the bondwires are used for carrying a signal of the internal circuitry of the IC. More particularly, in certain implementations the bondwires are used as inductors for the internal circuitry (e.g., a resonant tank) of the IC. In certain embodiments, a plurality of bondwires are coupled to a plurality of IC package pins, which are electrically coupled together. By carrying signals of opposite polarity on each of the bondwires, the inductance of such bondwires is minimized.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.