Apparatus and method for measuring the thickness of a thin film via the intensity of reflected light
US7304744B1 · kind B1 · utility
15Cited by
6References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 23, 1999 |
| Grant date | Dec 4, 2007 |
| Priority date | — |
| Expiry date | Dec 23, 2019 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N21/8422
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A thin film thickness measurement apparatus that can measure immediately after film growth thickness of a thin film of a substrate that is grown includes a light receiving/projecting unit directing light substantially perpendicular to the substrate and receiving light reflected from the substrate, and an analyze unit analyzing thickness of a thin film of the substrate according to intensity of reflected light received by the light receiving/projecting unit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.