Integrated circuit including external electronic components with low insertion loss
US7304863B1 · kind B1 · utility
3Cited by
3References
19Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 9, 2003 |
| Grant date | Dec 4, 2007 |
| Priority date | — |
| Expiry date | Oct 17, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit package can include electronic components used to enhance the performance of the integrated circuit that is part of the package. In order to reduce some adverse effects of including the electronic components, void regions are introduced into portions of the integrated circuit package interconnect layers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.