Die ejector system using linear motor
US7305757B2 · kind B2 · utility
1Cited by
6References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 15, 2004 |
| Grant date | Dec 11, 2007 |
| Priority date | — |
| Expiry date | Jun 16, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53274
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A die ejector system and method for removing a die from an adhesive surface. The system includes an ejector tool that is operative to move relative to the die whereby to push the die. The ejector tool may consist of a collet holder and an ejector pin array. A shaft holds the ejector tool and is in turn coupled to a forcer of a linear motor. The forcer is movable relative to a stator of the linear motor flexure bearings coupled to the shaft guide movement of the ejector tool relative to the die. After the die is pushed by the ejector tool, a die pick-up device removes the die from the adhesive surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.