System and method for wet cleaning a semiconductor wafer
US7306002B2 · kind B2 · utility
Inventors
Key dates
| Filing date | Jan 4, 2003 |
| Grant date | Dec 11, 2007 |
| Priority date | — |
| Expiry date | Oct 23, 2023 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB08B11/02
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
A system and method for cleaning a substrate, such as a semiconductor wafer, utilizes a rotatable wafer supporting assembly with a cylindrical body to provide stability for the substrate being cleaned, even at high rotational speeds. The rotatable wafer supporting assembly may include wafer holding mechanisms with pivotable confining members that are configured to hold the substrate using centrifugal force when the wafer supporting assembly is rotated. In an embodiment, the cleaning system may include a positioning system operatively connected to an acoustic transducer to provide meaningful control of the acoustic energy applied to a surface of the substrate by selectively changing the distance between the acoustic transducer and the substrate surface so that the substrate can be cleaned more effectively.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.