Modular heat sink
US7306028B2 · kind B2 · utility
12Cited by
8References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 23, 2005 |
| Grant date | Dec 11, 2007 |
| Priority date | — |
| Expiry date | Jul 13, 2025 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF28F3/025
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A modular based heat sink which can be easily optimized for a given heat source relies upon both phase change based heat transfer and condenser modules that combine the efficiency of folded fin cooling and the efficiency of the two phase heat transfer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.