Bonding apparatus
US7306132B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 24, 2005 |
| Grant date | Dec 11, 2007 |
| Priority date | — |
| Expiry date | Jul 6, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/78823
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A bonding apparatus including a front link whose lower end is rotatably connected to a bonding arm and upper portion is rotatably connected to bonding head, and a rear link whose lower end is rotatably connected to the rear end of the bonding arm and upper portion is rotatably connected to the bonding head; and a hypothetical rotational center of capillary of the bonding arm is on a bonding surface and set to be the intersection of a line that connects upper and lower rotational centers of the front link and a line that connects upper and lower rotational centers of the rear link, wherein the immovable element of motor is fastened to the bonding head, and the rotational element of the motor is attached to the upper end of the rear link so that the rotational element rotates about the upper rotational center of the rear link.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.