Pattern forming method, image forming method, fine particle adsorption pattern forming method, conductive pattern forming method, pattern forming material and planographic printing plate
US7306895B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 21, 2004 |
| Grant date | Dec 11, 2007 |
| Priority date | — |
| Expiry date | Jul 10, 2025 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/038
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The invention provides a pattern forming method including providing a polymerization initiation layer which is obtained by fixing, by a cross-linking reaction, a polymer having functional groups having polymerization initiation ability and cross-linking groups at side chains, on a support, and forming a pattern including a preparation zone and a non-preparation zone of a graft polymer by preparing the graft polymer on the surface of the polymerization initiation layer using graft polymerization, by contacting a compound having a polymerizable group on the polymerization initiation layer and supplying energy imagewise; an image forming method which applies the pattern forming method; a pattern forming material; and a planographic printing plate. A fine particle adsorption pattern forming method and a conductive pattern forming method are also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.