Epoxy resin composition for encapsulating optical semiconductor element and optical semiconductor device using the same
US7307286B2 · kind B2 · utility
13Cited by
7References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 15, 2004 |
| Grant date | Dec 11, 2007 |
| Priority date | — |
| Expiry date | Nov 24, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
An epoxy resin composition for encapsulating an optical semiconductor element, which has small internal stress and also can obtain good light transmittance within a broad temperature range. An epoxy resin composition for encapsulating an optical semiconductor element comprising the following component (A):(A) an epoxy resin complex which comprises an epoxy resin as the matrix component and silicon dioxide particles (a) dispersed therein:(a) silicon dioxide particles having an average particle size of from 5 to 40 nm measured by the small angle neutron scattering (SANS).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.