Semiconductor device and manufacturing method thereof
US7307288B2 · kind B2 · utility
Assignees
Inventor
Key dates
| Filing date | Sep 8, 2004 |
| Grant date | Dec 11, 2007 |
| Priority date | — |
| Expiry date | Sep 8, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/0236
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A semiconductor device capable of incorporating an element configured to accept and emit light having a short wavelength and a manufacturing method thereof are provided. A semiconductor element is housed in an enclosure which includes a bottom portion and side portions and having an aperture on an upper part thereof. Leads are buried in the bottom portion, and an end of each of the leads is arranged so as to approach the semiconductor element. The semiconductor element is connected to the leads by use of metal wires. The aperture of the enclosure is covered with a lid made of a transparent material for transmitting light accepted or emitted by the semiconductor element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.