Integrated radio front-end module with embedded circuit elements
US7307331B2 · kind B2 · utility
21Cited by
17References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 16, 2004 |
| Grant date | Dec 11, 2007 |
| Priority date | — |
| Expiry date | Aug 10, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A highly integrated radio front-end module. In one embodiment a semiconductor substrate is processed with various circuit components in the substrate, as well as interconnections for the various circuit components, embedding the circuit components into the substrate. One or more circuit components may be further connected with a separate integrated circuit, the separate integrated circuit bonded to the semiconductor substrate via contact points processed into the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.