Semiconductor device having curved leads offset from the center of bonding pads
US7307339B2 · kind B2 · utility
0Cited by
5References
10Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 8, 2004 |
| Grant date | Dec 11, 2007 |
| Priority date | — |
| Expiry date | Feb 17, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device including: a substrate on which a plurality of leads are formed; and a semiconductor chip mounted on the substrate in such a manner that a surface of the semiconductor chip having a plurality of electrodes faces the substrate. Each of the leads includes a first portion that is bonded to one of the electrodes and a second portion that extends outward from the inner side of a region in the substrate that overlays the semiconductor chip. The second portion is entirely adhered to the substrate and curved.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.