Multi-network modules with hot-swap capability
US7307987B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 23, 2004 |
| Grant date | Dec 11, 2007 |
| Priority date | — |
| Expiry date | Jul 20, 2026 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F13/4081
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A payload module (202) includes a payload subunit (212) coupled to the payload module, where the payload module has one of a 3U form factor, a 6U form factor and a 9U form factor. At least one multi-gigabit connector (218) is coupled to a rear edge (219) of the payload module and to the payload subunit, where the at least one multi-gigabit connector is coupled to communicatively interface the payload subunit to a backplane (204), where the backplane includes a switched fabric (206) coincident with at least one of a VMEbus network and a PCI network, and where the switched fabric and at least one of the VMEbus network and the PCI network are communicatively coupled with the payload subunit through the at least one multi-gigabit connector. A payload module power connector (242) includes a plurality of pins (243), where at least one of the plurality of pins has a length different from a remaining portion of the plurality of pins such that power between a main power bus (207) on the backplane and a payload module power bus (240) on the payload module is at least one of applied and removed, in a smooth and gradually ramped fashion over a time period (302, 304), where power and any concur…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.