Low profile surface mount connector
US7309252B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 22, 2005 |
| Grant date | Dec 18, 2007 |
| Priority date | — |
| Expiry date | Feb 22, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R13/42
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A low profile connector assembly comprises at least one contact having a surface mount portion and a wire engagement portion extending from the surface mount portion, and a housing insertable over the at least one contact and retained to the at least one contact. The housing encloses the wire engagement portion and has a wire receiving aperture therethrough. The wire receiving aperture provides access to the wire engagement portion when the housing is retained to the contact.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.