System for forming composite polymer dielectric film
US7309395B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 31, 2004 |
| Grant date | Dec 18, 2007 |
| Priority date | — |
| Expiry date | Oct 2, 2024 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB05D7/52
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A system for depositing a composite polymer dielectric film on a substrate is disclosed, wherein the composite polymer dielectric film includes a low dielectric constant polymer layer disposed between a first silane-containing layer and a second silane-containing layer. The system includes a process module having a processing chamber and a monomer delivery system configured to admit a gas-phase monomer into the processing chamber for deposition of the low dielectric constant polymer layer, a post-treatment module for annealing the composite polymer dielectric film, and a silane delivery system configured to admit a vapor flow containing a silane precursor into at least one of the process module and the post-treatment module for the formation of the first silane-containing layer and the silane-containing layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.