Use of sacrificial layers in the manufacture of high performance systems on tailored substrates
US7309620B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 13, 2003 |
| Grant date | Dec 18, 2007 |
| Priority date | — |
| Expiry date | Jan 13, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/977
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention relates to methods for preparing a removable system on a mother substrate. The method deposits a high surface to volume sacrificial layer on a mother substrate and stabilizes the sacrificial layer by a) removing volatile chemical species in and on the sacrificial layer and/or b) modifying the surface of the layer. The method coats over the sacrificial layer with a capping medium. A system is the fabricated on the capping medium. The method provides through holes to access the sacrificial layer. The method may also apply a top layer onto the system to form a covered system. The invention also includes the step of removing the sacrificial layer to release the system from the mother substrate. Methods of the invention also include selectively removing a portion of the system and capping layers to form void regions defining an array of islands composed of device, structure, or system and capping layer regions, and optionally filling the island-defining void region with a sacrificial material. In such methods the sacrificial material and the high surface to volume sacrificial layer are removed to release the system from the mother substrate. Methods of the invention also i…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.