Organopolysiloxane composition and electronic part encapsulated therewith
US7309733B2 · kind B2 · utility
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8Claims
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Key dates
| Filing date | Sep 16, 2004 |
| Grant date | Dec 18, 2007 |
| Priority date | — |
| Expiry date | Apr 11, 2025 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09D183/04
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
An organopolysiloxane composition which contains from 0.01% to less than 0.5% by weight of a sulfidable metal powder is provided. When a silver-containing precision electronic part is encapsulated or sealed with the cured composition, the metal powder in the cured composition is sulfided with sulfur-containing gas, thereby preventing or retarding the corrosion of the encapsulated or sealed electronic part with the sulfur-containing gas.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.