Modularized redundant heat sink for dissipating heat generated from chips
US7310226B2 · kind B2 · utility
11Cited by
13References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 22, 2005 |
| Grant date | Dec 18, 2007 |
| Priority date | — |
| Expiry date | Mar 10, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A modularized redundant heat sink for dissipating heat generated from chips includes an independent rectangular fin whose sides are provided with at least more than two elastic pins, and which is provided with a bottom surface for conducting temperature; a circuit board on which are welded with at least more than two chips having upper surfaces. A bottom surface of the fin is attached to the upper surfaces of at least more than two chips through a heat conducting glue, so as to provide a temperature conducting and heat dissipating to at least more than two chips by one fin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.