Air shroud for dissipating heat from an electronic component
US7310228B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Apr 10, 2006 |
| Grant date | Dec 18, 2007 |
| Priority date | — |
| Expiry date | Jun 1, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20154
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A air shroud for dissipating heat from an electronic component is composed of a air shroud of a roughly U-shaped cross section, whose left and right sides are formed into a first and a second opening, respectively. A passage is formed between the first and second openings, enabling air to flow along a specific direction. A flexible thin piece is fixed inside the air shroud which covers a specific electronic component on a circuit board, and the flexible thin piece is touched with a surface of the electronic component. The fast-flowing air flows quickly along the passage, so as to effectively cool down a working temperature of the specific electronic component, thereby increasing a lifetime of usage of the specific electronic component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.