Apparatus and method for transferring heat from an electrical module
US7310233B2 · kind B2 · utility
23Cited by
12References
2Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jan 28, 2005 |
| Grant date | Dec 18, 2007 |
| Priority date | — |
| Expiry date | Jan 26, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20509
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An apparatus for transferring heat from an electrical module includes: (a) a thermally conductive base member having a plurality of edges establishing a polygonal perimeter and having a first side for presentation toward the electrical module; and (b) a heat transferring structure integrally formed with the base member and extending from a second side of the base member opposite from the first side. The heat transferring structure occupies less than all of the second side and establishes a margin substantially about the perimeter.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.