Computer enclosure
US7310872B2 · kind B2 · utility
11Cited by
25References
29Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 27, 2004 |
| Grant date | Dec 25, 2007 |
| Priority date | — |
| Expiry date | Mar 10, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49171
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A computing device having an improved enclosure arrangement is disclosed. One aspect of the enclosure pertains to enclosure parts that are structurally bonded together to form a singular composite structure. In one embodiment, structural glue is used to bond at least two unique parts together. Another aspect of the enclosure pertains to enclosure parts that are electrically bonded together to form a singular integrated conductive member. In one embodiment, conductive paste is used to bond at least two unique parts together. The improved enclosure is particularly useful in portable computing devices such as laptop computers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.