Electrical circuits with button plated contacts and assembly methods
US7311240B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 30, 2004 |
| Grant date | Dec 25, 2007 |
| Priority date | — |
| Expiry date | May 11, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0545
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Exemplary methods for making a solder joint between two articles are disclosed. The method includes the steps of positioning a first article and a second article to be soldered together. At least one of the first article and the second article has at least one button attached to it. The button has a desired height above a surface of the article to which it is attached. The second article has a quantity of solder located in a position where the solder joint is to be formed. A heat source is applied until the quantity of solder liquefies. The heat source is removed until the solder solidifies with a uniform thickness approximately equal to the height of the button.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.