Patent · US Expired

Method and device for the process regulation or control of thermal load changes of an obstruction-curved and/or thick-walled component through which a medium flows in a thermal system

US7311264B2 · kind B2 · utility

9Cited by
8References
11Claims
0Family size

Assignee

Inventors

Key dates

Filing dateMar 15, 2004
Grant dateDec 25, 2007
Priority date
Expiry dateJan 4, 2026

Classification

  • Technology area (CPC G)Physics
  • CPC primaryG05B13/021
  • WIPO fieldControl
  • WIPO sectorInstruments

Abstract

The novel method and device provide for process control—closed-loop control or open-loop control—for a thermal system with an obstruction-curved and/or thick-walled component through which a medium flows. The wall temperatures of the component are detected, the heat flux density of the heat flux from the medium into the wall of the component is determined, the respective heat transmission coefficient is determined, using the wall temperatures. The heat flux density, and the heat transmission coefficient thus determined are used to influence the medium properties, with the heat stresses in the component being taken into account.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.