Polymer encapsulation of high aspect ratio materials and methods of making same
US7312257B2 · kind B2 · utility
1Cited by
56References
53Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 23, 2003 |
| Grant date | Dec 25, 2007 |
| Priority date | — |
| Expiry date | Feb 16, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2982
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
Embodiments of this invention comprise a pigment comprising one or more substantially spherical-shaped beads, wherein each substantially spherical-shaped bead comprises one or more high aspect ratio particles encapsulated within an encapsulating material. Embodiments also comprise a resinous composition comprising said pigment. Yet further embodiments comprise a method of preparing said pigment via suspension polymerization.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.