Semiconductor substrate with interconnections and embedded circuit elements
US7312505B2 · kind B2 · utility
7Cited by
14References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 31, 2004 |
| Grant date | Dec 25, 2007 |
| Priority date | — |
| Expiry date | Jan 8, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A semiconductor substrate integrated with interconnections and circuit components. A silicon backplane is processed with silicon processing to provide electrical connectivity for circuit elements. In one embodiment functional circuit elements, e.g., MEMS, switches, filters, are integrated on the silicon backplane. In one embodiment the function circuit elements are monolithically processed into the silicon backplane. In one embodiment the silicon backplane includes interconnections for integrated circuits on different substrates to be bonded to the silicon backplane.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.