Interconnect structure with polygon cell structures
US7312512B2 · kind B2 · utility
9Cited by
4References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 28, 2005 |
| Grant date | Dec 25, 2007 |
| Priority date | — |
| Expiry date | Feb 3, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Interconnect structures with polygonal cell structures. An exemplary interconnect structure comprises a substrate and a first dielectric layer, overlying the substrate and exposing a conductive feature formed therethrough and connected with the substrate, wherein the first dielectric layer includes a plurality of polygon cell structures with hollow interior.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.