Mounting member of semiconductor device, mounting configuration of semiconductor device, and drive unit of semiconductor device
US7312522B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Oct 28, 2004 |
| Grant date | Dec 25, 2007 |
| Priority date | — |
| Expiry date | Nov 13, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A mounting member of a semiconductor device according to the present invention includes a wiring substrate to input and/or output actuating signals to a semiconductor device, a power supplying conductor plate to supply actuating power to the semiconductor device, and the GND conductor plate. The wiring substrate, the power supplying conductor plate, and the GND conductor plate are laminated with insulation films between respective layers. Input/output signals as well as minute driving current is supplied from wiring substrate, and the large main driving current is supplied through the power supplying conductor plate as well as the GND conductor plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.