Space transformers employing wire bonds for interconnections with fine pitch contacts
US7312617B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Mar 20, 2006 |
| Grant date | Dec 25, 2007 |
| Priority date | — |
| Expiry date | Jul 6, 2026 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R1/07357
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Method and apparatus for electrical testing of a device under test (DUT) that employs a connection board with signal contacts for applying test signals and a space transformer that has low pitch contacts arranged on one or more circumferential shelves that define an enclosure in the space transformer. The apparatus has a substrate with fine pitch contacts positioned such that these are within the enclosure. A set of wire bonds is used for pitch reduction by interconnecting the fine pitch contacts with the low pitch contacts arranged on the shelves. The probes are connected to the fine pitch contacts and are used to apply the test signals to a DUT by contacting its pads. In some embodiments, the fine pitch contacts may be embodied by plugs or by blind metal vias.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.