Semiconductor test unit having low contact resistance with examined electronic products, semiconductor contact board, method for testing semiconductor device, semiconductor device, and method for manufacturing thereof
US7312621B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 31, 2003 |
| Grant date | Dec 25, 2007 |
| Priority date | — |
| Expiry date | Feb 10, 2026 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2863
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A semiconductor test unit comprises a test circuit for inputting/outputting a test signal to/from an examined electronic product, a test signal wiring electrically connected to the test circuit, a contact board electrically connected to an electrode of the examined electronic product and provided with an electrically conductive via to which the test signal is transmitted, a multilayer circuit board electrically connected to the conductive via and the test signal wiring, located under the bottom face of the contact board, and provided with at least one through-hole, and a vacuum attachment mechanism for attaching thereto and holding the examined electronic product, the contact board, and the multilayer circuit board by vacuum. The contact board is made of an insulative material, has top and bottom faces, and is provided with at least one through-hole.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.