Adaptable thin plate modular heat exchanger blade for cooling electronic equipment
US7312987B1 · kind B1 · utility
42Cited by
1References
19Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 9, 2005 |
| Grant date | Dec 25, 2007 |
| Priority date | — |
| Expiry date | Jan 17, 2026 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2200/201
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A computer peripheral system is provided that include at least one fluid cooled blade. The fluid cooled blade is formed by first and second walls that are secured together to form a fluid flow path. A supply of cooling fluid is connected to an inlet port to supply cooling fluid to the fluid flow path. An outlet port is connected to the fluid flow path that directs fluid to a fluid outlet. The fluid cooled blade is assembled to the rack in close proximity to the electronic modules that require cooling. In one embodiment, the fluid cooled blade may be laminated or otherwise connected to one or more electronic circuit boards.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.