High density drive chassis assembly
US7312999B1 · kind B1 · utility
30Cited by
9References
40Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 29, 2005 |
| Grant date | Dec 25, 2007 |
| Priority date | — |
| Expiry date | May 12, 2026 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11B33/128
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention is an apparatus for supporting the dense integration of a plurality of multi-drive modules. A chassis assembly of the present invention may house a plurality of multi-drive modules whereby each multi-drive module may house multiple drives. Each multi-drive module may be easily removed from the chassis for reduced serviceability time. Each drive may be housed within a carrier assembly, the carrier assembly being easily removed from the multi-drive module of the present invention. Advantageously, a dense integration of drives may be achieved while providing proper ventilation and vibration dampening.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.