System and method for actively cooling transducer assembly electronics

US7314447B2 · kind B2 · utility

Assignee

• Siemens Medical Solutions USA, Inc. · US

Inventors

• William J. Park · Sunnyvale, US
• Vaughn R. Marian · Saratoga, US
• David A. Petersen · Clearwater, US
• Todor Sheljaskow · Kenosha, US
• Mirsaid S. Boloforosh · Portola Valley, US
• Worth B. Walters · Cupertino, US
• Sevig Ayter · Cupertino, US

Key dates

• Filing date: Mar 15, 2004
• Grant date: Jan 1, 2008
• Expiry date: Dec 5, 2024

Classification

• Technology area (CPC A): Human Necessities
• CPC primary: A61B8/445
• WIPO field: Medical technology
• WIPO sector: Instruments

Abstract

An ultrasound transducer assembly is disclosed having a housing, a transducer array mounted in the housing and an electronics assembly mounted in the housing, the electronics assembly including one or more sub-assemblies having heat generating components disposed thereon. The electronics sub-assemblies further include thermal conducting features which conduct heat generated by the heat generating components out of the electronics assembly where it can be further removed by other thermal management techniques. These other thermal management techniques may include techniques utilized to cool the transducer array.