Low temperature texturing layer to enhance adhesion of subsequent layers
US7314832B2 · kind B2 · utility
32Cited by
1References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 4, 2005 |
| Grant date | Jan 1, 2008 |
| Priority date | — |
| Expiry date | Apr 4, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/805
Abstract
A method of forming a film on a substrate. In accordance with the invention, an adhesion layer is formed on the substrate. The adhesion layer is chemically bonded to the substrate and has a textured surface. The film is then formed on the textured surface of the adhesion layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.